上海新国际博览中心2026.11.10-12

108th China Electronics Fair (CEF)

November 10-12, 2026
Shanghai New International Expo Centre

Theme:Strengthen Foundation and Chain, Intelligent Manufacturing Upgrades

Concurrently Held with:
2026 Autumn National Special Electronic Components Exhibition
2026 China Semiconductor Industry and Application Expo
2026 China International 30th Small Motor Technology, Magnetic Materials Technology, and Robotics Technology Symposium and Exhibition

Organization

Host:China Electronic Appliance Corporation

Organizer:CEAC Expo and Information Communication Co., Ltd.

23,000+㎡

Booth area

600+

Exhibitors

25,000+

Visits

20+

Large Delegations

5000+

Buyer Representatives

46+

Matchmaking Sessions

China Electronics Fair (CEF),
driven by independent innovation and powered by technological innovation, promotes high-quality development

China's electronic information industry has entered a new era. The high-quality development action for key industrial chains has achieved phased results, new breakthroughs have been made in industrial technological innovation, and the industrial structure has been further optimized and upgraded. Independent innovation of core technologies, modernization of industrial chains, and security and controllability are important components of China's high-quality development. Electronic components, as the solid cornerstone of the information technology industry, not only support the vigorous development of the entire industry but are also the top priority for maintaining the security and stability of industrial and supply chains. China Electronics Fair will be driven by core technologies and products such as basic electronic components, semiconductors, and intelligent manufacturing equipment, expanding technological innovation in application fields including special electronics, automotive electronics, advanced manufacturing, artificial intelligence & intelligent terminals, and power and energy, promoting the development of China's new quality productive forces, assisting industrial development, and paving a solid runway for enterprises to soar.

Shanghai,
Building a Highland for Electronic Information Industry Development, Serving the Nation as a High-End Manufacturing Growth Pole

As the core carrier of a world-class electronic information industry cluster, Shanghai deeply collaborates with the Yangtze River Delta region. Industrial agglomeration and competitiveness continue to improve, and the stability and resilience of industrial chains have significantly strengthened. New business forms and models are constantly emerging. The electronic information industry has powerfully supported Shanghai's urban digital transformation and high-quality development, providing solid momentum for building the "One Core, Three Foundations, Four Frontiers, Five Ends" modern industrial system during the "14th Five-Year Plan" period. The "Shanghai Manufacturing" brand continues to gain prominence, and a number of world-class industrial clusters are accelerating their formation, laying a solid foundation for building an excellent manufacturing base that links the Yangtze River Delta, serves the nation, and faces the world.

Looking ahead to the "15th Five-Year Plan," Shanghai will continue to strengthen its leading role in key areas such as integrated circuits, artificial intelligence, and intelligent terminals, promote the deep integration of industrial chains, innovation chains, and value chains, further consolidate its core position in the global electronic information industry landscape, and better serve national strategies and new demands for industrial development.

Exhibitor Satisfaction Survey Analysis

  • Highly praised or basically satisfied with visitor quantity

  • Highly praised or basically satisfied with visitor quality

  • Satisfied or basically satisfied with exhibition publicity and organization

  • Willing to recommend the electronics fair to partners or friends

Exhibition Content

Hall W2:Basic Electronics and Industrial Support Theme Hall

Core Leading Components

  • Resistors / Capacitors / Inductors:Miniature chip resistors and capacitors, RF resistors and capacitors, high-performance inductors, supercapacitors.
  • Frequency and Filter Components:Miniature RF filters, resonators, surface acoustic wave/bulk acoustic wave devices.
  • Special Components and Materials:Special PCB materials, electronic functional materials (ceramics, magnetic, etc.), circuit protection components.
  • Connection and Switching:Connectors, high-speed transmission cables and connection components, control relays, switches.
  • Electromechanical Energy Conversion:Transformers, micro special motors, servo motors.
  • Energy Storage and Management:High-end lithium batteries, fuel cells, battery management systems, etc.

Integrated Circuits

  • IC Design:MCU, DSP, FPGA, CPU/GPU/NPU, analog chips, digital-to-analog/analog-to-digital converters, power management chips, driver chips (motor, display, etc.), RF chips.
  • Semiconductor Manufacturing and Advanced Packaging:Third-generation semiconductor materials and devices (SiC, GaN), power semiconductors, automotive semiconductors (automotive-grade chips), SIP (System-in-Package), wafer manufacturing services, packaging and testing services.
  • IC Support:IC design tools (EDA), IC testing and verification equipment, semiconductor materials.

Semiconductor Equipment and Core Components

  • Semiconductor Manufacturing Equipment and Core Components:Wafer manufacturing equipment, packaging manufacturing equipment, testing equipment, semiconductor material equipment, key components (such as RF power supplies, vacuum pumps, precision ceramic parts).
  • Discrete Semiconductor Devices:Diodes, transistors (MOSFET, IGBT, etc.), thyristors.
  • Optoelectronic Devices:LEDs, lasers, photodetectors, display devices.
  • Special Devices:Vacuum devices, solid-state microwave devices, MEMS devices.

Intelligent Manufacturing

  • Electronic Manufacturing Equipment:SMT technology and equipment, welding equipment, electronic manufacturing automation equipment, visual inspection systems.
  • Process Environment and Materials:ESD anti-static and purification equipment, adhesives, electronic chemicals.
  • Testing, Measurement and Certification:Testing and measurement instruments, environmental reliability testing equipment, electronic manufacturing services (EMS), quality and standard services.
  • Cable and Wire Harness Equipment:EMS systems, terminal machines, copper strip machines, tinning machines, wire stripping machines, dispensing machines, winding and tying machines, ultrasonic welding machines, terminal cross-section detectors.
content

Hall W3:System Applications and Solutions Theme Hall

Special Electronics and Military-Civilian Integration

Components, materials, equipment, and systems meeting military standards/high reliability requirements, covering solid-state microwave devices, vacuum devices, electric energy, microsystems, etc.

Automotive Electronics

Automotive-grade semiconductors/components, motors, electronic controls, wiring harnesses, vehicle body electronic control devices, in-vehicle electronic devices, smart cockpits, telematics, autonomous driving solutions.

Artificial Intelligence and Intelligent Terminals

AI chips and algorithms, machine vision, intelligent voice, drones, robots, AR/VR, smart wearables.

Power Electronics and Energy Systems

Power components (such as high-voltage capacitors, reactors), power conversion devices (inverters, converters), new energy power generation and energy storage system solutions.

Exhibition Content

Standard Booth
RMB 15,000/unit (3m×3m)
Double-Open Booth
RMB 16,500/unit (3m×3m)
Raw Space
RMB 1,500/m² (min. 36m²)

Concurrent Events

Technical Forum Exchange Activities

  • Electronic Components Supply Chain Security Development Forum
  • China IC Unicorn Forum
  • China Semiconductor Industry High-Quality Development Innovation Forum
  • SIP System-in-Package Technology Conference
  • China Semiconductor Equipment and Core Components New Progress Forum
  • China LED Development and Application Forum
  • China Photovoltaic Industry Development Conference
  • AI Empowers Future Industrial Inspection Equipment Application Forum
  • Automotive Electronics Industry Chain Summit Forum
  • New Energy Vehicle Wire Harness and Connector Technology Innovation Forum
  • From Chip to System — Building an Efficient AI Hardware Ecosystem Forum
  • Robotics Technology Progress and Application Prospects Forum
  • Low-Altitude Economy Intelligent Development Forum
  • Special Electronic Components Independent Innovation Development Forum

New Product and New Technology Launch Events

  • Special Sessions for Components, Integrated Circuits, Automotive Electronics, Special Electronics, etc.

Supply and Demand Matchmaking

  • Electronic Components Procurement and Selection Technology Salon and Supply-Demand Matching Activities
  • Special Electronics Supply-Demand Matchmaking Activity
  • Automotive Electronics Procurement and Supply Matchmaking Conference
  • Electronic Engineers Carnival

Industry Awards

  • Electronic Components Industry Survey and Trend Release
  • China IC Unicorn List Release
  • Semiconductor Industry High-Quality Development Innovation Achievement Release

Production Demonstration

  • China Electronic Intelligent Manufacturing Factory (Assembly) Demonstration Line

Industry Competition

  • National Electronic Manufacturing Industry Welding Expert Finals

Exhibition Value-Added Services

Enhance Exhibition Effectiveness, Help Build Corporate Brand

  • 01
    Buyer Matching
  • 02
    VIP Buyer Group Invitation
  • 03
    Exhibitor Self-Invited Customer Privileges
  • 04
    Professional Technical Speeches
  • 05
    Key Media Interviews
  • 06
    Exhibition Express Interviews
  • 07
    Advertising Opportunities
  • 08
    New Product Promotion
  • 09
    WeChat Promotion

Scan the QR code to register and get your admission ticket.

Contact

  • CEAC Expo and Information Communication Co., Ltd.

  • Beijing: 010-51662329

  • WeChat: 13811460483

  • Email: haoxy@ceac.com.cn